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Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 2: Optical performance of LiDAR
30.60 Close of voting/ comment period
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 3: Thermal imagers
20.99 WD approved for registration as CD
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 5: Ultrasonic devices
40.20 DIS ballot initiated: 12 weeks
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 6: Visual Imaging devices
40.20 DIS ballot initiated: 12 weeks
Fully flexible organic light emitting diode (OLED) panels for general lighting - Performance requirements
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
LED lamps – Safety requirements
40.99 Full report circulated: DIS approved for registration as FDIS
LED Light sources – Performance requirements
50.00 Final text received or FDIS registered for formal approval
Coupled-stress acceleration test sequence for photovoltaic modules and materials
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Measurement of ozone generation from UV-C radiation sources and luminaires
30.20 CD study/ballot initiated
Germicidal equipment - Low-pressure mercury UV radiation sources for germicidal purpose - Safety
40.00 DIS registered
Electrical safety of Snow melting photovoltaic (Snow PV) module - Requirements for construction and testing
40.99 Full report circulated: DIS approved for registration as FDIS
Visual comfort of display terminals - Part 1: Introduction
40.99 Full report circulated: DIS approved for registration as FDIS
Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 1: Transmittance evaluation method of EUV pellicle
50.00 Final text received or FDIS registered for formal approval
Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 3: Nano-scale wafer surface inspection method using UV light
40.00 DIS registered
Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 4: Evaluation methods for dimensional accuracy of laser dicing process
40.60 Close of voting
Quantum Interconnect – Part 1: Introduction and roadmap for standardization
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
English