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Required Specification Of Package Substrates For Advanced Semiconductor Packaging - Part 1: Current-Induced Quality Test Method for Package Substrate
20.99 WD approved for registration as CD
Bushing application guide - Part 1: Bushing selection and installation
20.99 WD approved for registration as CD
Semiconductor devices - Neuromorphic devices - Part 1: Evaluation method of basic characteristics in memristor devices
50.00 Final text received or FDIS registered for formal approval
Semiconductor devices - Neuromorphic devices - Part 2: Evaluation method of linearity in memristor devices
50.00 Final text received or FDIS registered for formal approval
Semiconductor devices - Neuromorphic devices - Part 3: Evaluation method of spike dependent plasticity in memristor devices
50.00 Final text received or FDIS registered for formal approval
Semiconductor devices - Neuromorphic devices - Part 4: Evaluation method of asymmetry in memristor devices
40.99 Full report circulated: DIS approved for registration as FDIS
<p>Semiconductor devices - Neuromorphic devices - Part 5: Evaluation method of endurance and retention in memristor devices</p>
30.20 CD study/ballot initiated
Semiconductor devices - Neuromorphic devices - Part 6：Evaluation method of basic characteristics in one transistor one memristor (1T1M) arrays
30.20 CD study/ballot initiated
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 1: Combined LD-PD for LiDAR
40.20 DIS ballot initiated: 12 weeks
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 2: Optical performance of LiDAR
30.60 Close of voting/ comment period
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 3: Thermal imagers
20.99 WD approved for registration as CD
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 5: Ultrasonic devices
40.60 Close of voting
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 6: Visual Imaging devices
40.60 Close of voting
Fully flexible organic light emitting diode (OLED) panels for general lighting - Performance requirements
50.60 Close of voting. Proof returned by secretariat
LED lamps – Safety requirements
50.00 Final text received or FDIS registered for formal approval
LED Light sources – Performance requirements
50.00 Final text received or FDIS registered for formal approval
Coupled-stress acceleration test sequence for photovoltaic modules and materials
50.60 Close of voting. Proof returned by secretariat
Concentric lay overhead electrical stranded conductors
40.20 DIS ballot initiated: 12 weeks
English