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Amendment 1 - Compression and mechanical connectors for power cables - Part 1-3: Test methods and requirements for compression and mechanical connectors for power cables for rated voltages above 1 kV (U<sub>m</sub> = 1,2 kV) up to 30 kV (U<sub>m</sub> = 36 kV) tested on non-insulated conductors
20.99 WD approved for registration as CD
Nuclear instrumentation - Portable gamma radiation meters and spectrometers used for prospecting - Definitions, requirements and calibration
40.20 DIS ballot initiated: 12 weeks
Determination of long-term radiation ageing in polymers - Part 1: Techniques for monitoring diffusion-limited oxidation
30.60 Close of voting/ comment period
Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
50.00 Final text received or FDIS registered for formal approval
Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
40.00 DIS registered
Materials for printed boards and other interconnecting structures - Part 2-56: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate
30.60 Close of voting/ comment period
Materials for circuit boards and other interconnecting structures - Part 3-7: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad
30.20 CD study/ballot initiated
Materials for circuit boards and other interconnecting structures - Part 3-8: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad
30.20 CD study/ballot initiated
Materials for circuit boards and other interconnecting structures - Part 3-9: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad
30.20 CD study/ballot initiated
Nuclear power plants - Instrumentation and control systems important to safety - Detection of leakage in coolant systems
60.00 Standard under publication
Electrical insulating materials and systems - Part 2: DC voltage endurance evaluation
50.00 Final text received or FDIS registered for formal approval
Amendment 1 - Fibre-optic communication subsystem test procedures - Part 4-2: Installed cabling plant - Single-mode attenuation and optical return loss measurements
40.60 Close of voting
Optical amplifiers - Test methods - Part 11-1: Polarization mode dispersion parameter - Jones matrix eigenanalysis (JME)
40.60 Close of voting
Insulating liquids - Determination of the partial discharge inception voltage (PDIV) - Test procedure
20.99 WD approved for registration as CD
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-19: Tests - Damp heat (steady state)
30.99 CD approved for registration as DIS
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-21: Tests - Composite temperature/humidity cyclic test
50.60 Close of voting. Proof returned by secretariat
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