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High-voltage direct current (HVDC) systems - Guidance to the specification and design evaluation of AC filters - Part 3: Modelling aspects
40.99 Full report circulated: DIS approved for registration as FDIS
Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
High frequency inductive components - Electrical characteristics and measuring methods - Part 3: AC loss measured by sinusoidal wave of inductors for DC-to-DC converters
30.99 CD approved for registration as DIS
Amendment 1 - Passive RF and microwave devices, intermodulation level measurement - Part 2: Measurement of passive intermodulation in coaxial cable assemblies
50.99 FDIS or proof approved for publication
Amendment 1 - Passive RF and microwave devices, intermodulation level measurement - Part 4: Measurement of passive intermodulation in coaxial cables
50.99 FDIS or proof approved for publication
Amendment 1 - Passive RF and microwave devices, intermodulation level measurement - Part 6: Measurement of passive intermodulation in antennas
50.99 FDIS or proof approved for publication
Passive RF and microwave devices, intermodulation level measurement - Part 7: Field measurements of passive intermodulation
30.20 CD study/ballot initiated
Uninterruptible power systems (UPS) - Part 1: Safety requirements
40.00 DIS registered
Uninterruptible power systems (UPS) - Part 5-1: DC output UPS - Safety requirements
20.99 WD approved for registration as CD
Amendment 1 - Uninterruptible power systems (UPS) - Part 5-3: DC output UPS - Performance and test requirements
20.99 WD approved for registration as CD
Safety of machinery - Application of protective equipment to detect the presence of persons
40.99 Full report circulated: DIS approved for registration as FDIS
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
40.99 Full report circulated: DIS approved for registration as FDIS
Semiconductor devices - Micro-electromechanical devices - Part 49: Temperature and humidity test methods for piezoelectric MEMS cantilevers
40.99 Full report circulated: DIS approved for registration as FDIS
Semiconductor Devices - Micro-electromechanical Devices - Part 51: Test method of electrical characteristics under two-directional cyclic bending deformation for flexible micro-electromechanical devices
30.99 CD approved for registration as DIS
Semiconductor Devices - Micro-electromechanical Devices - Part 52: Biaxial tensile testing method for stretchable MEMS
40.20 DIS ballot initiated: 12 weeks
Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
40.99 Full report circulated: DIS approved for registration as FDIS
Micro-electromechanical devices - Part 54: Silicon based MEMS fabrication technology - Test method of microstructure tensile
20.99 WD approved for registration as CD
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