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Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-1: Special requirements for testing of crystalline silicon photovoltaic (PV) modules
20.99 WD approved for registration as CD
Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-2: Special requirements for testing of thin-film Cadmium Telluride (CdTe) based photovoltaic (PV) modules
20.99 WD approved for registration as CD
Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-3: Special requirements for testing of thin-film amorphous silicon based photovoltaic (PV) modules
20.99 WD approved for registration as CD
Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-4: Special requirements for testing of thin-film Cu(In,GA)(S,Se)2 based photovoltaic (PV) modules
20.99 WD approved for registration as CD
Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-6: Special requirements for testing of metal halide perovskite-containing photovoltaic (PV) modules
20.99 WD approved for registration as CD
Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 2: Test procedures
20.99 WD approved for registration as CD
Nuclear power plants - Control rooms - Operator controls
30.99 CD approved for registration as DIS
Amendment 1 - Compression and mechanical connectors for power cables - Part 1-1: Test methods and requirements for compression and mechanical connectors for power cables for rated voltages up to 1 kV (U<sub>m</sub> = 1,2 kV) tested on non-insulated conductors
20.99 WD approved for registration as CD
Amendment 1 - Compression and mechanical connectors for power cables - Part 1-2: Test methods and requirements for insulation piercing connectors for power cables for rated voltages up to 1 kV (U<sub>m</sub> = 1,2 kV) tested on insulated conductors
20.99 WD approved for registration as CD
Amendment 1 - Compression and mechanical connectors for power cables - Part 1-3: Test methods and requirements for compression and mechanical connectors for power cables for rated voltages above 1 kV (U<sub>m</sub> = 1,2 kV) up to 30 kV (U<sub>m</sub> = 36 kV) tested on non-insulated conductors
20.99 WD approved for registration as CD
Nuclear instrumentation - Portable gamma radiation meters and spectrometers used for prospecting - Definitions, requirements and calibration
40.20 DIS ballot initiated: 12 weeks
Determination of long-term radiation ageing in polymers - Part 1: Techniques for monitoring diffusion-limited oxidation
30.20 CD study/ballot initiated
Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
40.99 Full report circulated: DIS approved for registration as FDIS
Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
30.99 CD approved for registration as DIS
Materials for printed boards and other interconnecting structures - Part 2-56: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate
30.60 Close of voting/ comment period
Materials for circuit boards and other interconnecting structures - Part 3-7: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad
20.99 WD approved for registration as CD
Materials for circuit boards and other interconnecting structures - Part 3-8: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad
20.99 WD approved for registration as CD
Materials for circuit boards and other interconnecting structures - Part 3-9: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad
20.99 WD approved for registration as CD
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