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Thermography test method for printed circuit interconnection defects
10.20 New project ballot initiated
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad
10.20 New project ballot initiated
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad
10.20 New project ballot initiated
Thermal Endurance Test Method for Flexible Optic-Electric Circuit
00.99 Approval to ballot proposal for new project
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES– DESIGN AND USE - Part 8: 3D shape data for CAD component library
00.99 Approval to ballot proposal for new project
Electrical Relays – Electromagnetic Compatibility
10.20 New project ballot initiated
Measuring relays and protection equipment - Part 1xx Functional requirements for fault location
00.99 Approval to ballot proposal for new project
Requirements and roadmap for DC protection function standardisation
00.00 Proposal for new project received
Insulation co-ordination for HVDC system — Part 1: Definitions, principles and rules
00.99 Approval to ballot proposal for new project
Insulation co-ordination for HVDC system — Part 2: Application guidelines for line commutated converter (LCC) stations
00.99 Approval to ballot proposal for new project
Electromagnetic compatibility of appliances, electric tools and similar apparatus - Part 3: Limits and methods of measurement of electromagnetic emissions for professional equipment in commercial and light-industrial locations
10.20 New project ballot initiated
Internet of Things (IoT) – IoT application on power distribution system: Architecture and functional requirements
00.99 Approval to ballot proposal for new project
(AWI) Internet of Things (IoT) – Environmental and ecological effects, risks, and considerations of underwater acoustic signalling
00.00 Proposal for new project received
(AWI) (ISO/IEC TR 40141) Internet of Things (IoT) – Reference architecture guidance
00.00 Proposal for new project received
Internet of Things (IoT) – Architecture considerations for IoT, edge and cloud
00.00 Proposal for new project received
(AWI) Internet of Things (IoT) – Guidelines on testing of IoT devices
00.00 Proposal for new project received
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