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Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages
00.00 Proposal for new project received
IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages
00.99 Approval to ballot proposal for new project
IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
Test method of sound variation detection sensors for fire detection
00.99 Approval to ballot proposal for new project
Semiconductor devices - Part 20: Machine-Interpretable Data Sheet for Power Semiconductors: Requirements for Data Format and Data Access for Power Electronic Design Tools
10.60 Close of voting
Semiconductor devices - Part 14-15: Semiconductor sensors - Performance test method of dynamic vision sensors
10.60 Close of voting
Semiconductor sensors - Measurement method for microchannel integrated resonant mass sensors in surface adsorption mode
10.60 Close of voting
Semiconductor devices - Test method of pH sensors for metabolic status assessment of cultured cells
10.20 New project ballot initiated
Semiconductor devices – Micro-electromechanical devices – Part 68: Test methods for magnetostriction coefficient of MEMS magnetic thin films
10.20 New project ballot initiated
Semiconductor devices - Micro-electromechanical devices - Part 69: MEMS packaging residual stress test methods based on stress amplification structure
10.20 New project ballot initiated
Semiconductor devices – Micro-electromechanical devices – Part 70 :Double Cantilever Beam Test with Compliance Measurement for MEMS Hybrid Bonding Interface Characterization
10.20 New project ballot initiated
CONNECTORS FOR ELECTRONIC EQUIPMENT PRODUCT REQUIREMENTS Part 8-10X: Power connectors – Detail specification for 2-pole snap locking power rectangular connectors with plastic housing for rated current of 63 A
00.99 Approval to ballot proposal for new project
Mechanical structures for electrical and electronic equipment – Walk-in enclosures – Part 1: Design guidelines
10.20 New project ballot initiated
Molded Inductors – Guidelines on the limits of surface irregularities
10.20 New project ballot initiated
<em>Standardized Data Format for Mission Profiles</em>
00.00 Proposal for new project received
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