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FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS – FIBRE OPTIC CONNECTOR INTERFACES – Part 35: Type LSHE connector series for harsh environments
00.99 Approval to ballot proposal for new project
Future IEC 61300-3-55: FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS – BASIC TEST AND MEASUREMENT PROCEDURES – Part 3-55: Examination and measurements – Polarisation extinction ratio and keying accuracy of polarisation maintaining, passive, optical components
00.99 Approval to ballot proposal for new project
Fiber Optic Active Components and Devices – Test and Measurement Procedures – Part 8: Universal vertical mezzanine boards for photonic devices
10.20 New project ballot initiated
Underwater acoustics ̶ Calibration of interferometric fiber-optic hydrophones in the frequency range 10 Hz to 20 kHz
10.20 New project ballot initiated
Wind energy generation systems - Part 15-2: Framework for assessment and reporting of the wind resource and energy yield
10.60 Close of voting
Grid-forming technology and applications in renewable energy dominated power systems
00.00 Proposal for new project received
Business Use Cases (BUCs) of Flexibility Services
10.20 New project ballot initiated
Primary Frequency Coordinated Control Framework of System with High Penetration of Inverter Based Generation
00.00 Proposal for new project received
Railway Applications – Requirements for software development
10.20 New project ballot initiated
Materials for printed boards and other interconnecting structures - Part 2-XX: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate
10.60 Close of voting
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad
10.60 Close of voting
Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer
10.20 New project ballot initiated
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