DPS
Drejtoria e Përgjithshme e Standardizimit
Phone: +355 4 222 62 55
E-mail: info@dps.gov.al
Address: Address: "Reshit Collaku" Str., (nearby ILDKPKI, VI floor), Po.Box 98, Tiranë - Albania
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Projects

Use the form below to find the searched projects. Enter your criteria for searching (single or in combination) in the fields below and press the button “Search”.

IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages

00.99 Approval to ballot proposal for new project

TC 47/SC 47D more

IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates

00.00 Proposal for new project received

TC 47/SC 47D more

IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates

00.00 Proposal for new project received

TC 47/SC 47D more

Test method of sound variation detection sensors for fire detection

00.99 Approval to ballot proposal for new project

TC 47/SC 47E more

Semiconductor devices - Part 20: Machine-Interpretable Data Sheet for Power Semiconductors: Requirements for Data Format and Data Access for Power Electronic Design Tools

10.60 Close of voting

TC 47/SC 47E more

Semiconductor devices - Part 14-15: Semiconductor sensors - Performance test method of dynamic vision sensors

10.60 Close of voting

TC 47/SC 47E more

Semiconductor sensors - Measurement method for microchannel integrated resonant mass sensors in surface adsorption mode

10.20 New project ballot initiated

TC 47/SC 47E more

Semiconductor devices - Test method of pH sensors for metabolic status assessment of cultured cells

10.20 New project ballot initiated

TC 47/SC 47E more

Semiconductor devices - Micro-electromechanical devices - Part 66: Test method for processing electrophysiological impedance data obtained from 3D cell-tissue models in MEMS chip array-based high-throughput screening systems

10.20 New project ballot initiated

TC 47/SC 47F more

Semiconductor devices - Micro-electromechanical devices - Part 67: Microfluidic device for droplet-based 3D cell cultivation

10.20 New project ballot initiated

TC 47/SC 47F more

CONNECTORS FOR ELECTRONIC EQUIPMENT PRODUCT REQUIREMENTS Part 8-10X: Power connectors – Detail specification for 2-pole snap locking power rectangular connectors with plastic housing for rated current of 63 A

00.99 Approval to ballot proposal for new project

TC 48 more

Mechanical structures for electrical and electronic equipment – Walk-in enclosures – Part 1: Design guidelines

10.20 New project ballot initiated

TC 48/SC 48D more

Inductors - Near Magnetic and Electric Field Characterization

00.00 Proposal for new project received

TC 51 more

<em>Standardized Data Format for Mission Profiles</em>

00.00 Proposal for new project received

TC 56 more

Role-based Access Control – Definition of roles and permissions for engineering

00.99 Approval to ballot proposal for new project

TC 57 more

Part 90-33: Use of IEC 61850 for the Data Centers domain

00.99 Approval to ballot proposal for new project

TC 57 more

Power system IED communication and associated data models for interoperability - Role Based Access Control (RBAC) with IEC 61850 (61850-90-19)

00.99 Approval to ballot proposal for new project

TC 57 more

Power systems management and associated information exchange – Data and communications security – Part 16: Profiles for Ethernet security, MACsec (IEC 62351-16)

00.99 Approval to ballot proposal for new project

TC 57 more