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Household electric appliances - Specification of the properties of a digital system for measuring the performance
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
IIoT applications in power distribution systems management: Architecture and functional requirements
50.60 Close of voting. Proof returned by secretariat
Guideline for the planning and design of direct current or hybrid microgrids
20.99 WD approved for registration as CD
LED light source characteristics - Part 1: Data sheets
60.00 Standard under publication
Fluids for electrotechnical application: Specifications for the re-use of mixtures of gases alternative to SF<sub>6</sub>
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Performance of voltage sourced converter (VSC) based high-voltage direct current (HVDC) transmission - Part 2: Transient conditions
30.60 Close of voting/ comment period
Semiconductor devices - Semiconductor devices for IoT system - Part 2: Test method of semiconductor photon sources incorporating human factors for wearable equipment
30.20 CD study/ballot initiated
Carbon footprint calculation applicable to industrial lithium-ion batteries - Part 1: General requirements and methodology
50.60 Close of voting. Proof returned by secretariat
Materials used in photovoltaic (PV) cells - Part 1: Specifications for electrical characteristics of crystalline silicon wafers
50.60 Close of voting. Proof returned by secretariat
Quantification and communication of carbon footprint, GHG emission reductions and avoided emissions from electric and electronic products and systems - Principles, methodologies, requirements and guidance (Proposed horizontal publication)
60.00 Standard under publication
Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages
30.99 CD approved for registration as DIS
Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages
30.99 CD approved for registration as DIS
Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
60.00 Standard under publication
Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device
40.60 Close of voting
Vehicle connector, vehicle inlet and cable assembly for Megawatt DC charging
60.00 Standard under publication
<p>Standard Interface for Connecting Charging stations to Local Energy Management Systems - Part-4 Test Specifications</p>
20.99 WD approved for registration as CD
Management of Distributed Energy Storage Systems based on Electrically Chargeable Vehicles (ECV-DESS) - Part 2: Data models Protocols, Messages
20.99 WD approved for registration as CD
Management of Distributed Energy Storage Systems based on Electrically Chargeable Vehicles (ECV-DESS) - Part 3: Conformance tests
20.99 WD approved for registration as CD
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