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Industrial networks – 5G communication technology – Part 3: Specification of features needed for industrial automation
20.99 WD approved for registration as CD
Industrial networks – 5G communication technology– Part 4: Specification for the deployment of 5G in an IA plant
20.99 WD approved for registration as CD
Replay Tools for radioactive material detection systems
30.60 Close of voting/ comment period
Application of IEC 63339 to Smart Manufacturing Reference Models
50.00 Final text received or FDIS registered for formal approval
Application of IEC 63339 to smart manufacturing reference models
30.99 CD approved for registration as DIS
Plugs, socket-outlets, ship couplers for low-voltage shore connection systems (LVSC-systems) in Direct Current (DC)
30.20 CD study/ballot initiated
Guidelines for joint control for hydroelectric power plants
20.99 WD approved for registration as CD
Evaluation of hydrophobicity retention of polymeric insulating materials under high voltage stress with the dynamic drop test
40.00 DIS registered
Arc hazards and safety aspects in LVDC power distribution system – Part 1: Series arc characteristics between brass and copper-alloy electrodes
30.20 CD study/ballot initiated
Performance of power electronic transformer for flexible transmission and distribution systems
50.00 Final text received or FDIS registered for formal approval
Grid compliance test for photovoltaic power plants
20.99 WD approved for registration as CD
Hazard analysis due to using C-UAS system in nuclear site
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Quantum technologies – Terminology and quantities – General quantities
20.99 WD approved for registration as CD
Semiconductor devices - Reliability test methods for vibration energy harvesters - Part 1: Mechanical reliability under shock
40.60 Close of voting
Semiconductor devices - Reliability test methods for vibration energy harvesters - Part 2: Temperature and humidity
30.60 Close of voting/ comment period
Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 1: Guideline for thermal design of applications where the heat dissipation path to the board is dominant
30.99 CD approved for registration as DIS
Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements
40.00 DIS registered
Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples
30.60 Close of voting/ comment period
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