DPS
Drejtoria e Përgjithshme e Standardizimit
Phone: +355 4 222 62 55
E-mail: info@dps.gov.al
Address: Address: "Reshit Collaku" Str., (nearby ILDKPKI, VI floor), Po.Box 98, Tiranë - Albania
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Projects

Use the form below to find the searched projects. Enter your criteria for searching (single or in combination) in the fields below and press the button “Search”.

Twinaxial, biaxial, and general-purpose single-pair cable assemblies for high-speed data communications

00.00 Proposal for new project received

TC 46 more

Radio frequency and coaxial cable assemblies - Part 1-1: Guidance, additional specifications, and test methods for cable assemblies for reference measurements and test fixtures

00.00 Proposal for new project received

TC 46 more

IEC 62783-1-3 Ed 1.0: Twinax cables for digital communications - Part 1-3: Time-domain test methods for Twinax cables for digital communications, Propagation delay, intra-pair skew and inter-pair skew

00.00 Proposal for new project received

TC 46/SC 46C more

Specification of a TD measurement method for twin-axial cables

00.00 Proposal for new project received

TC 46/SC 46C more

Radio-frequency connectors - Part 1-8: Electrical test methods -Voltage standing wave ratio for a single connector by double connector method

00.99 Approval to ballot proposal for new project

TC 46/SC 46F more

Integrated Circuits - Standard roadmap for chiplet ICs

00.00 Proposal for new project received

TC 47/SC 47A more

integrated circuits – Three Dimensional Integrated Circuits Part x: In-line thermal measurement of warpage

00.00 Proposal for new project received

TC 47/SC 47A more

Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages

00.00 Proposal for new project received

TC 47/SC 47A more

IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages

00.99 Approval to ballot proposal for new project

TC 47/SC 47D more

IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates

00.00 Proposal for new project received

TC 47/SC 47D more

IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates

00.00 Proposal for new project received

TC 47/SC 47D more

Future IEC TR 60191-7-2 Ed.1: Thermal conductivity measurement method and samples for electronic components

00.00 Proposal for new project received

TC 47/SC 47D more

Thermal standardization on semiconductor packages – Part 7: Background and glossary of Thermal Simulation and Compact Thermal Models on Semiconductor Packaging

00.00 Proposal for new project received

TC 47/SC 47D more

Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device

10.60 Close of voting

TC 47/SC 47D more

Test method of sound variation detection sensors for fire detection

00.99 Approval to ballot proposal for new project

TC 47/SC 47E more

Semiconductor devices -Part 5-17: Optoelectronic devices - Light emitting diode - Measuring methods of optoelectronic parameters of micro scale light emitting diode array

00.99 Approval to ballot proposal for new project

TC 47/SC 47E more

Semiconductor devices - Part 5-17: Optoelectronic devices - Light emitting diode - Measuring methods of optoelectronic parameters of micro scale light emitting diode array

10.60 Close of voting

TC 47/SC 47E more

Micro-electromechanical systems-Part 57: RF MEMS Directional Coupler

10.20 New project ballot initiated

TC 47/SC 47F more