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Nuclear Power Plants - Instrumentation, control and electrical power systems - Application of simulation techniques
00.00 Proposal for new project received
<p>Electromagnetic compatibility (EMC) – Test method for measuring of transfer impedance Z<sub>T</sub> and screening attenuation a<sub>S</sub> or coupling attenuation a<sub>C</sub> on of connectors and assemblies up to and above 3 GHz -– Triaxial Ttube in tube method</p>
00.99 Approval to ballot proposal for new project
Guidance for coupling attenuation and screening attenuation measurement of hybrid cables and assemblies - Triaxial method (IEC 62153-5-x)
00.00 Proposal for new project received
Radio frequency and coaxial cable assemblies - Part 1-1: Guidance, additional specifications, and test methods for cable assemblies for reference measurements and test fixtures
00.00 Proposal for new project received
IEC 62783-1-3 Ed 1.0: Twinax cables for digital communications - Part 1-3: Time-domain test methods for Twinax cables for digital communications, Propagation delay, intra-pair skew and inter-pair skew
00.00 Proposal for new project received
Specification of a TD measurement method for twin-axial cables
00.00 Proposal for new project received
Radio-frequency connectors - Part 1-8: Electrical test methods -Voltage standing wave ratio for a single connector by double connector method
00.99 Approval to ballot proposal for new project
Integrated Circuits - Standard roadmap for chiplet ICs
00.00 Proposal for new project received
Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages
00.00 Proposal for new project received
IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages
00.99 Approval to ballot proposal for new project
IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
Future IEC TR 60191-7-2 Ed.1: Thermal conductivity measurement method and samples for electronic components
00.00 Proposal for new project received
Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device
10.60 Close of voting
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