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Drejtoria e Përgjithshme e Standardizimit

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PWI 47D-12

IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates

General information

Current stage: 00.00 Effective date: Feb 2, 2024

Next stage: PREPNW Next stage date: Feb 28, 2029

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

Life cycle

NOW

IN_DEVELOPMENT
PWI 47D-12
00.00 Proposal for new project received
Feb 2, 2024