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PWI 47D-12

IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates

General information

00.00     2 shk 2024

PREPNW    28 shk 2029

IEC

TC 47/SC 47D

International Standard

Scope

Life cycle

NOW

IN_DEVELOPMENT
PWI 47D-12
00.00 Proposal for new project received
2 shk 2024