Use the form below to find the searched projects. Enter your criteria for searching (single or in combination) in the fields below and press the button “Search”.
Semiconductor devices - Detection modules of autonomous land vehicle - Part 4: Testing methods of performance for millimeter-wave radar
10.60 Close of voting
Semiconductor devices - Detection modules of autonomous land vehicle - Part 5: Testing methods of performance for ultrasonic modules
10.60 Close of voting
Semiconductor devices - Detection modules of autonomous land vehicle - Part 6: Testing methods of performance for visual imaging modules
10.60 Close of voting
Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 4: Evaluation methods for dimensional accuracy of laser dicing process
10.60 Close of voting
Reliability evaluation methods for vibration energy harvesters - Part 2: Temperature and humidity
10.20 New project ballot initiated
Semiconductor devices - semiconductor devices for IOT system - part 2: test method of semiconductor photon sources incorporating human factors for wearable equipment
10.20 New project ballot initiated
Integrated Circuits – Electronic fuses for low voltage automotive power distribution networks
00.99 Approval to ballot proposal for new project
Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages
00.00 Proposal for new project received
IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages
00.99 Approval to ballot proposal for new project
Model creation method using a measurement data of semiconductor device
00.00 Proposal for new project received
IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
IECxxxxx: Date Code of individual electronic components
00.99 Approval to ballot proposal for new project
Future IEC TR 60191-7-2 Ed.1: Thermal conductivity measurement method and samples for electronic components
00.00 Proposal for new project received
Test method of sound variation detection sensors for fire detection
00.99 Approval to ballot proposal for new project
Micro-electromechanical devices - Part 56: Test method for characteristics of MEMS metal oxide semiconductor (MOS) type gas sensor
10.20 New project ballot initiated
Shqip