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PNW 47D-989 ED1

Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device

General information

10.60     Jun 6, 2025

IEC

TC 47/SC 47D

International Standard

Life cycle

NOW

IN_DEVELOPMENT
PNW 47D-989 ED1
10.60 Close of voting
Jun 6, 2025