Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device
General information
10.606 qer 2025
IEC
TC 47/SC 47D
International Standard
Scope
Life cycle
NOW
IN_DEVELOPMENT PNW 47D-989 ED1 10.60
Close of voting 6 qer 2025