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LED Light sources – Performance requirements
40.99 Full report circulated: DIS approved for registration as FDIS
Coupled-stress acceleration test sequence for photovoltaic modules and materials
20.99 WD approved for registration as CD
Power Electronic Converters part of Distributed Energy Resources (DER) - Test methods and guidance for assessment of functional requirements related to safety and power quality
20.99 WD approved for registration as CD
Concentric lay overhead electrical stranded conductors
20.99 WD approved for registration as CD
Excimer sources for germicidal purpose - Safety specifications
30.99 CD approved for registration as DIS
Measurement of ozone production from UV-C radiation sources and luminaires
20.99 WD approved for registration as CD
Germicidal equipment - Low-pressure mercury UV radiation sources for germicidal purpose - Safety specifications
30.99 CD approved for registration as DIS
Qi Specification version 2.0 - Part 10: MPP System Specification
60.00 Standard under publication
Qi Specification version 2.0 - Part 11: MPP Communications Protocol
60.00 Standard under publication
Qi Specification version 2.0 - Part 8: NFC Tag Protection
60.00 Standard under publication
Qi Specification version 2.0 - Part 9: Authentication Protocol
60.00 Standard under publication
Electrical safety of Snow melting photovoltaic (Snow PV) module - Requirements for construction and testing
30.60 Close of voting/ comment period
Visual comfort of display terminals - Part 1: Introduction
40.99 Full report circulated: DIS approved for registration as FDIS
Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 1: Transmittance evaluation method of EUV pellicle
30.99 CD approved for registration as DIS
Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 3: Nano-scale wafer surface inspection method using UV light
20.99 WD approved for registration as CD
Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 4: Evaluation methods for dimensional accuracy of laser dicing process
30.20 CD study/ballot initiated
Quantum Interconnect – Part 1: Introduction and roadmap for standardization
30.60 Close of voting/ comment period
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