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Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects
50.00 Final text received or FDIS registered for formal approval
High voltage direct current (HVDC) substation audible noise
50.00 Final text received or FDIS registered for formal approval
Requirements of bidirectional wireless power transfer for electric vehicles
20.99 WD approved for registration as CD
Amendment 2 - Railway applications - Fixed installations - DC switchgear - Part 6: DC switchgear assemblies
60.00 Standard under publication
Artificial intelligence enabled medical devices - Data management
10.60 Close of voting
Hydraulic machines - Acceptance tests of small hydroelectric installations
20.99 WD approved for registration as CD
Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
30.20 CD study/ballot initiated
Amendment 1 - Electrical accessories - Residual current monitors (RCMs) - Part 1: RCMs for household and similar uses
40.20 DIS ballot initiated: 12 weeks
Passive RF and microwave devices, intermodulation level measurement - Part 7: Field measurements of passive intermodulation
50.99 FDIS or proof approved for publication
Uninterruptible power systems (UPS) - Part 1: Safety requirements
40.99 Full report circulated: DIS approved for registration as FDIS
Uninterruptible power systems (UPS) - Part 5-1: DC output UPS - Safety requirements
20.99 WD approved for registration as CD
Amendment 1 - Uninterruptible power systems (UPS) - Part 5-3: DC output UPS - Performance and test requirements
20.99 WD approved for registration as CD
Cores made of soft magnetic materials - Measuring methods - Part 2: Magnetic properties at low excitation level
30.99 CD approved for registration as DIS
Semiconductor devices - Micro-electromechanical devices - Part 51: Test method of electrical characteristics under two-directional cyclic bending deformation for flexible micro-electromechanical devices
50.00 Final text received or FDIS registered for formal approval
Semiconductor devices - Micro-electromechanical devices - Part 54: Silicon based MEMS fabrication technology – Measurement method of tensile strength of microstructures
40.20 DIS ballot initiated: 12 weeks
Semiconductor devices - Micro-electromechanical devices - Part 55: Silicon based MEMS fabrication technology - Test method of microstructure pendulum impact
30.99 CD approved for registration as DIS
Semiconductor devices - Micro-electromechanical devices - Part 56: Test method for characteristics of MEMS metal oxide semiconductor (MOS) type gas sensor
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Semiconductor devices - Micro-electromechanical systems - Part 57: RF MEMS directional coupler
40.20 DIS ballot initiated: 12 weeks
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