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Application of IEC 63339 to smart manufacturing reference models
30.99 CD approved for registration as DIS
Plugs, socket-outlets, ship couplers for low-voltage shore connection systems (LVSC-systems) in Direct Current (DC)
20.99 WD approved for registration as CD
Guidelines for joint control for hydroelectric power plants
20.99 WD approved for registration as CD
Evaluation of hydrophobicity retention of polymeric insulating materials under high voltage stress with the dynamic drop test
30.20 CD study/ballot initiated
Guideline for Evaluating Bias Temperature Instability of Silicon Carbide Metal-Oxide-Semiconductor Devices for Power Electronic Conversion (Fast track)
50.00 Final text received or FDIS registered for formal approval
Guidelines for Representing Switching Losses of SIC MOSFETs in Datasheets (Fast track)
50.00 Final text received or FDIS registered for formal approval
Arc Hazards and Safety in LVDC - Part 1: Series arc characteristics between brass electrodes
20.99 WD approved for registration as CD
Performance of power electronics transformer for flexible transmission and distribution systems
20.99 WD approved for registration as CD
Grid compliance test for photovoltaic power plants
20.99 WD approved for registration as CD
Hazard analysis due to using C-UAS system in nuclear site
50.00 Final text received or FDIS registered for formal approval
Quantum technologies – Terminology and quantities – General quantities
20.99 WD approved for registration as CD
Semiconductor devices - Reliability evaluation methods for vibration energy harvesters - Part 1 : Mechanical reliability under shock
30.60 Close of voting/ comment period
Reliability evaluation methods for vibration energy harvesters - Part 2: Temperature and humidity
20.99 WD approved for registration as CD
Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 1: Guideline for thermal design of applications where the heat dissipation path to the board is dominant
30.20 CD study/ballot initiated
Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements
30.20 CD study/ballot initiated
Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples
20.99 WD approved for registration as CD
Augmented and Mixed Reality equipment and systems – Technology and standards requirements
50.00 Final text received or FDIS registered for formal approval
VR/AR/MR Systems and Equipment – Glossary of terms
20.99 WD approved for registration as CD
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