IEC 60749-23:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

Publication date: 30 mar 2011

General information

Current stage: 99.60 Effective date: 9 dhj 2025

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

Buying

Statusi: Revised

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Scope

This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62189:2000 ED1

NOW

WITHDRAWN
IEC 60749-23:2004 ED1
99.60 Withdrawal effective
9 dhj 2025

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-23:2004/AMD1:2011 ED1

REVISED BY

PUBLISHED
IEC 60749-23:2025 ED2