IEC 60749-23:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

Publication date: Mar 30, 2011

General information

Current stage: 99.60 Effective date: Dec 9, 2025

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Languages: English French

Buying

Status: Revised

PDF - ALL 9,611

Paper - ALL 9,611

CD - ALL 9,611

Language

Language in which you want to receive the document.

Scope

This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62189:2000 ED1

NOW

WITHDRAWN
IEC 60749-23:2004 ED1
99.60 Withdrawal effective
Dec 9, 2025

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-23:2004/AMD1:2011 ED1

REVISED BY

PUBLISHED
IEC 60749-23:2025 ED2