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IEC 60749-23:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

Mar 30, 2011

General information

60.60     Feb 23, 2004

IEC

TC 47

International Standard

31.080.01  

English   French  

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Scope

This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62189:2000 ED1

NOW

PUBLISHED
IEC 60749-23:2004 ED1
60.60 Standard published
Feb 23, 2004

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60749-23:2004/AMD1:2011 ED1

REVISED BY

IN_DEVELOPMENT
IEC 60749-23 ED2