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IEC 60749-23 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

General information

50.20     Oct 3, 2025

PRVD    Nov 14, 2025

IEC

TC 47

International Standard

31.080.01  

Scope

IEC 60749-23 ED2 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document.
This edition includes the following significant technical changes with respect to the previous edition:
- absolute stress test definitions and resultant test durations have been updated.

Life cycle

NOW

IN_DEVELOPMENT
IEC 60749-23 ED2
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Oct 3, 2025

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