IEC 60749-23 ED2 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document.
This edition includes the following significant technical changes with respect to the previous edition:
- absolute stress test definitions and resultant test durations have been updated.
IN_DEVELOPMENT
IEC 60749-23 ED2
50.20
Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Oct 3, 2025
Only informative sections of projects are publicly available. To view the full content, you will need to create an account. If you are a member, please log in to your account by clicking on the "Log in" button.