IEC 61188-6-2:2021 ED1

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

Publication date: 4 shk 2021

General information

Current stage: 60.60 Effective date: 4 shk 2021

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 31.190

Gjuha: anglisht frëngjisht

Buying

Statusi: Publikuar

PDF - 16 960 Lekë

Paper - 16 960 Lekë

CD - 16 960 Lekë

Language

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Scope

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

Life cycle

PREVIOUSLY

PUBLISHED
IEC 61188-5-2:2003 ED1

PUBLISHED
IEC 61188-5-6:2003 ED1

PUBLISHED
IEC 61188-5-8:2007 ED1

PUBLISHED
IEC 61188-5-3:2007 ED1

PUBLISHED
IEC 61188-5-4:2007 ED1

PUBLISHED
IEC 61188-5-5:2007 ED1

NOW

PUBLISHED
IEC 61188-6-2:2021 ED1
60.60 Standard published
4 shk 2021

National adoptions

SSH EN IEC 61188-6-2:2021

DPS

Borde të printuara dhe asemblime bordesh të printuara - Projektim dhe përdorim - Pjesa 6-2: Projektimi i modelit tokësor - Përshkrimi i modelit tokësor për komponentët më të zakonshëm të montuar në sipërfaqe (SMD)

60.60 Standard published

DPS/KT 8 më tepër