IEC 61188-5-5:2007 ED1

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

Publication date: 30 tet 2007

General information

Current stage: 60.60 Effective date: 30 tet 2007

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Gjuha: anglisht frëngjisht

Buying

Statusi: Publikuar

PDF - 30 529 Lekë

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Scope

IEC 61188-5-5:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1 :2002.

Life cycle

NOW

PUBLISHED
IEC 61188-5-5:2007 ED1
60.60 Standard published
30 tet 2007

REVISED BY

PUBLISHED
IEC 61188-6-2:2021 ED1

IN_DEVELOPMENT
IEC 61188-6-3 ED1