IEC 61188-5-2:2003 ED1

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

Publication date: 24 qer 2003

General information

Current stage: 60.60 Effective date: 24 qer 2003

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 31.190

Gjuha: anglisht frëngjisht

Buying

Statusi: Publikuar

PDF - 33 921 Lekë

Paper - 33 921 Lekë

CD - 33 921 Lekë

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Scope

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

Life cycle

NOW

PUBLISHED
IEC 61188-5-2:2003 ED1
60.60 Standard published
24 qer 2003

REVISED BY

PUBLISHED
IEC 61188-6-2:2021 ED1

IN_DEVELOPMENT
IEC 61188-6-3 ED1