IEC 61188-5-4:2007 ED1

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Publication date: 30 tet 2007

General information

Current stage: 60.60 Effective date: 30 tet 2007

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Gjuha: anglisht frëngjisht

Buying

Statusi: Publikuar

PDF - 9 046 Lekë

Paper - 9 046 Lekë

CD - 9 046 Lekë

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Scope

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Life cycle

NOW

PUBLISHED
IEC 61188-5-4:2007 ED1
60.60 Standard published
30 tet 2007

REVISED BY

PUBLISHED
IEC 61188-6-2:2021 ED1

IN_DEVELOPMENT
IEC 61188-6-3 ED1