IEC 61188-5-4:2007 ED1

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Publication date: Oct 30, 2007

General information

Current stage: 60.60 Effective date: Oct 30, 2007

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Languages: English French

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Status: Published

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Scope

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Life cycle

NOW

PUBLISHED
IEC 61188-5-4:2007 ED1
60.60 Standard published
Oct 30, 2007

REVISED BY

PUBLISHED
IEC 61188-6-2:2021 ED1

IN_DEVELOPMENT
IEC 61188-6-3 ED1