IEC 61188-6-2:2021 ED1

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

Publication date: Feb 4, 2021

General information

Current stage: 60.60 Effective date: Feb 4, 2021

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 31.190

Languages: English French

Buying

Status: Published

PDF - ALL 16,960

Paper - ALL 16,960

CD - ALL 16,960

Language

Language in which you want to receive the document.

Scope

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

Life cycle

PREVIOUSLY

PUBLISHED
IEC 61188-5-2:2003 ED1

PUBLISHED
IEC 61188-5-6:2003 ED1

PUBLISHED
IEC 61188-5-8:2007 ED1

PUBLISHED
IEC 61188-5-3:2007 ED1

PUBLISHED
IEC 61188-5-4:2007 ED1

PUBLISHED
IEC 61188-5-5:2007 ED1

NOW

PUBLISHED
IEC 61188-6-2:2021 ED1
60.60 Standard published
Feb 4, 2021

National adoptions

SSH EN IEC 61188-6-2:2021

DPS

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

60.60 Standard published

DPS/KT 8 more