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SSH EN IEC 61188-6-2:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

Nov 24, 2021

General information

60.60     Nov 24, 2021

95.60   

DPS

DPS/KT 8

European Norm

31.180     31.190  

English  

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Scope

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

Life cycle

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PUBLISHED
SSH EN IEC 61188-6-2:2021
60.60 Standard published
Nov 24, 2021

Related project

Adopted from EN IEC 61188-6-2:2021 IDENTICAL

Adopted from IEC 61188-6-2:2021 ED1 IDENTICAL