IEC 61188-5-6:2003 ED1

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

Publication date: Jan 23, 2003

General information

Current stage: 60.60 Effective date: Jan 23, 2003

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.190

Languages: English French

Buying

Status: Published

PDF - ALL 13,003

Paper - ALL 13,003

CD - ALL 13,003

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Scope

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

Life cycle

NOW

PUBLISHED
IEC 61188-5-6:2003 ED1
60.60 Standard published
Jan 23, 2003

REVISED BY

PUBLISHED
IEC 61188-6-2:2021 ED1

IN_DEVELOPMENT
IEC 61188-6-3 ED1