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Industrial networks – 5G communication technology – General considerations
50.00 Final text received or FDIS registered for formal approval
Replay Tools for radioactive material detection systems
30.60 Close of voting/ comment period
Application of IEC 63339 to Smart Manufacturing Reference Models
50.00 Final text received or FDIS registered for formal approval
Application of IEC 63339 to smart manufacturing reference models
30.60 Close of voting/ comment period
Plugs, socket-outlets, ship couplers for low-voltage shore connection systems (LVSC-systems) in Direct Current (DC)
20.99 WD approved for registration as CD
Guidelines for joint control for hydroelectric power plants
20.99 WD approved for registration as CD
Evaluation of hydrophobicity retention of polymeric insulating materials under high voltage stress with the dynamic drop test
20.99 WD approved for registration as CD
Guideline for Evaluating Bias Temperature Instability of Silicon Carbide Metal-Oxide-Semiconductor Devices for Power Electronic Conversion (Fast track)
40.60 Close of voting
Guidelines for Representing Switching Losses of SIC MOSFETs in Datasheets (Fast track)
40.60 Close of voting
Arc Hazards and Safety in LVDC - Part 1: Series arc characteristics between brass electrodes
20.99 WD approved for registration as CD
Performance of power electronics transformer for flexible transmission and distribution systems
30.20 CD study/ballot initiated
Grid compliance test for photovoltaic power plants
20.99 WD approved for registration as CD
Hazard analysis due to using C-UAS system in nuclear site
40.99 Full report circulated: DIS approved for registration as FDIS
Quantum technologies – Terminology and quantities – General quantities
20.99 WD approved for registration as CD
Semiconductor devices - Reliability evaluation methods for vibration energy harvesters - Part 1 : Mechanical reliability under shock
30.60 Close of voting/ comment period
Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant
20.99 WD approved for registration as CD
Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites
20.99 WD approved for registration as CD
Measurement method used in thermal design for electronics assemblies - Part 3: Temperature measurement method for miniaturized SMDs on circuit boards
20.99 WD approved for registration as CD
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