Projects

Radio frequency and coaxial cable assemblies - Part 1-1: Guidance, additional specifications, and test methods for cable assemblies for reference measurements and test fixtures

00.00 Proposal for new project received

IEC 62783-1-3 Ed 1.0: Twinax cables for digital communications - Part 1-3: Time-domain test methods for Twinax cables for digital communications, Propagation delay, intra-pair skew and inter-pair skew

00.00 Proposal for new project received

Specification of a TD measurement method for twin-axial cables

00.00 Proposal for new project received

Radio-frequency connectors - Part 1-8: Electrical test methods -Voltage standing wave ratio for a single connector by double connector method

00.99 Approval to ballot proposal for new project

Radio frequency connectors – Part 1-10: Electrical test methods – Contact resistance

10.20 New project ballot initiated

<p>Semiconductor devices-Neuromorphic devices - Part 6：Evaluation method of basic characteristics in one transistor one memristor (1T1M) arrays</p>

10.20 New project ballot initiated

<p>Semiconductor devices - Neuromorphic devices - Part 5: Evaluation method of endurance and retention in memristor devices</p>

10.20 New project ballot initiated

Semiconductor devices - Chip-scale testing for autonomous vehicles -Part 3: Thermal imagers

10.20 New project ballot initiated

Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 2: Optical performance of LiDAR

10.20 New project ballot initiated

Integrated Circuits - Standard roadmap for chiplet ICs

00.00 Proposal for new project received

integrated circuits – Three Dimensional Integrated Circuits Part x: In-line thermal measurement of warpage

00.00 Proposal for new project received

Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages

00.00 Proposal for new project received

IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages

00.99 Approval to ballot proposal for new project

IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates

00.00 Proposal for new project received

IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates

00.00 Proposal for new project received

Future IEC TR 60191-7-2 Ed.1: Thermal conductivity measurement method and samples for electronic components

00.00 Proposal for new project received

Thermal standardization on semiconductor packages – Part 7: Background and glossary of Thermal Simulation and Compact Thermal Models on Semiconductor Packaging

00.00 Proposal for new project received

Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device

10.60 Close of voting