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SSH EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Nov 24, 2021

General information

60.60     Nov 24, 2021

95.60   

DPS

DPS/KT 8

European Norm

31.180     31.190  

English  

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Scope

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

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PUBLISHED
SSH EN IEC 61188-6-1:2021
60.60 Standard published
Nov 24, 2021

Related project

Adopted from EN IEC 61188-6-1:2021 IDENTICAL

Adopted from IEC 61188-6-1:2021 ED1 IDENTICAL