IEC 61188-6-1:2021 ED1

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Publication date: Feb 23, 2021

General information

Current stage: 60.60 Effective date: Feb 23, 2021

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 31.190

Languages: English French

Buying

Status: Published

PDF - ALL 28,268

Paper - ALL 28,268

CD - ALL 28,268

Language

Language in which you want to receive the document.

Scope

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61188-5-1:2002 ED1

NOW

PUBLISHED
IEC 61188-6-1:2021 ED1
60.60 Standard published
Feb 23, 2021

National adoptions

SSH EN IEC 61188-6-1:2021

DPS

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

60.60 Standard published

DPS/KT 8 more