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IEC 61188-5-1:2002 ED1

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

Jul 12, 2002

General information

99.60     Feb 24, 2021

WPUB   

IEC

TC 91

International Standard

31.180     31.190  

English   French  

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Replaced

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Scope

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Life cycle

NOW

WITHDRAWN
IEC 61188-5-1:2002 ED1
99.60 Withdrawal effective
Feb 24, 2021

REVISED BY

PUBLISHED
IEC 61188-6-1:2021 ED1