IEC 61188-5-1:2002 ED1

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

Publication date: 12 korr 2002

General information

Current stage: 99.60 Effective date: 24 shk 2021

Next stage: WPUB

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 31.190

Gjuha: anglisht frëngjisht

Buying

Statusi: Replaced

PDF - 41 271 Lekë

Paper - 41 271 Lekë

CD - 41 271 Lekë

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Scope

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Life cycle

NOW

WITHDRAWN
IEC 61188-5-1:2002 ED1
99.60 Withdrawal effective
24 shk 2021

REVISED BY

PUBLISHED
IEC 61188-6-1:2021 ED1