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SSH EN 61188-5-1:2002

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

Dec 18, 2006

General information

60.60     Jan 1, 2006

DPS

DPS/KT 4

European Norm

31.180     31.190  

English  

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Scope

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Life cycle

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PUBLISHED
SSH EN 61188-5-1:2002
60.60 Standard published
Jan 1, 2006

Related project

Adopted from EN 61188-5-1:2002

Adopted from IEC 61188-5-1 Ed. 1.0 b