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Interconnection of converter-based resources with power systems - Part 2: General requirements for marine energy generation
10.20 New project ballot initiated
Interconnection of converter-based resources with power systems - Part 10: Framework for the capability and performance of grid forming functions
10.20 New project ballot initiated
Microgrid - Part 3-7: Technical requirements - Data center microgrid monitoring, control, and energy management system
10.20 New project ballot initiated
Decentralized multi-energy systems - Integration of Power-to-X (P2X) systems into decentralized energy systems - Part 2-1: General principles, framework, and use cases
10.20 New project ballot initiated
Virtual Power Plant - Part 4: Primary Frequency Regulation Functional Requirements and Specification
10.20 New project ballot initiated
Power system stability and security management - Design and implement of automatic system - Coordinated Automatic Voltage Control for Power System with High Penetration of IBR (Inverter based Resource)
10.60 Close of voting
Electric power system restoration – Part 2-1: Resource planning – Use of VSC-HVDC for system restoration
10.60 Close of voting
Railway applications - Fixed installations - Requirements for the validation of simulation tools used for the design of electric traction power supply systems
10.20 New project ballot initiated
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad
10.60 Close of voting
Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer
10.60 Close of voting
Thermography test method for printed circuit interconnection defects
10.60 Close of voting
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad
10.60 Close of voting
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad
10.60 Close of voting
Thermal Endurance Test Method for Flexible Optic-Electric Circuit
00.99 Approval to ballot proposal for new project
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