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Grid Connection Requirements for Converter-Based Resources Interconnecting with Bulk Power Systems
10.20 New project ballot initiated
Grid-forming technology and applications in renewable energy dominated power systems
00.00 Proposal for new project received
Guidelines for assessment of power system resilience
00.99 Approval to ballot proposal for new project
Technical Specification for Automatic Voltage Control of Power System with Integration of lBR (Inverter based Resource)
10.20 New project ballot initiated
Technical Specification for System Restoration of Interconnected Power Systems Using VSC-HVDC
10.20 New project ballot initiated
Railway applications - Safety protocols for signaling applications - Part 1: Generic aspects of safety related transmission protocols
10.20 New project ballot initiated
Railway applicatios - Safety protocols for signaling applications - Part 3: PVS: Safety related transmission protocol for application between ground systems
10.20 New project ballot initiated
Railway applications - Safety protocols for signaling applications - Part 4: Rail Safe Transport Application Protocol
10.20 New project ballot initiated
Railway applications – Fixed installations – Lightning protection principles for overhead contact lines systems
10.20 New project ballot initiated
Railway Applications – Urban Guided Transport Management And Command/Control Systems – Part 4: Interface specifications
10.20 New project ballot initiated
Materials for printed boards and other interconnecting structures - Part 2-XX: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate
10.60 Close of voting
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad
10.60 Close of voting
Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer
10.60 Close of voting
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