IEC 61189-2-722 ED1

Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-722: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer

General information

Current stage: 30.20 Effective date: Sep 11, 2026

Next stage: PCC Next stage date: Nov 6, 2026

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-2-722 ED1
30.20 CD study/ballot initiated
Sep 11, 2026

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