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IEC 61189-2-722 ED1

Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-722: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer

General information

20.99     Aug 21, 2026

CD    Aug 21, 2026

IEC

TC 91

International Standard

31.180  

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-2-722 ED1
20.99 WD approved for registration as CD
Aug 21, 2026