Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad
General information
10.60Nov 14, 2025
IEC
TC 91
International Standard
Life cycle
NOW
IN_DEVELOPMENT PNW 91-2066 ED1 10.60
Close of voting Nov 14, 2025