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PNW 91-2066 ED1

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

General information

10.20     22 gush 2025

PRVN    14 nën 2025

IEC

TC 91

International Standard

Scope

Life cycle

NOW

IN_DEVELOPMENT
PNW 91-2066 ED1
10.20 New project ballot initiated
22 gush 2025