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PNW 91-2066 ED1

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

General information

10.60     14 nën 2025

IEC

TC 91

International Standard

Scope

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PNW 91-2066 ED1
10.60 Close of voting
14 nën 2025