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PNW 91-2074 ED1

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

General information

10.20     Oct 17, 2025

PRVN    Jan 9, 2026

IEC

TC 91

International Standard

Life cycle

NOW

IN_DEVELOPMENT
PNW 91-2074 ED1
10.20 New project ballot initiated
Oct 17, 2025