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IEC 61249-3-8 ED1

Materials for circuit boards and other interconnecting structures - Part 3-8: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

General information

30.60     Oct 30, 2026

IEC

TC 91

International Standard

31.180  

Life cycle

NOW

IN_DEVELOPMENT
IEC 61249-3-8 ED1
30.60 Close of voting/ comment period
Oct 30, 2026