IEC 61249-3-8 ED1

Materials for circuit boards and other interconnecting structures - Part 3-8: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

General information

Current stage: 30.20 Effective date: Sep 4, 2026

Next stage: PCC Next stage date: Oct 30, 2026

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Life cycle

NOW

IN_DEVELOPMENT
IEC 61249-3-8 ED1
30.20 CD study/ballot initiated
Sep 4, 2026

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