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IEC 63761 ED1

Thermography test method for defects circuit interconnection defects

General information

30.20     Aug 7, 2026

PCC    Oct 2, 2026

IEC

TC 91

International Standard

31.180     31.190  

Life cycle

NOW

IN_DEVELOPMENT
IEC 63761 ED1
30.20 CD study/ballot initiated
Aug 7, 2026

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