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Guidance for coupling attenuation and screening attenuation measurement of hybrid cables and assemblies - Triaxial method (IEC 62153-5-x)
00.00 Proposal for new project received
IEC 62783-1-3 Ed 1.0: Twinax cables for digital communications - Part 1-3: Time-domain test methods for Twinax cables for digital communications, Propagation delay, intra-pair skew and inter-pair skew
00.00 Proposal for new project received
Specification of a TD measurement method for twin-axial cables
00.00 Proposal for new project received
Radio-frequency connectors - Part 1-8: Electrical test methods -Voltage standing wave ratio for a single connector by double connector method
00.99 Approval to ballot proposal for new project
Radio frequency connectors - Part 1-11: Standardization of magnetic property evaluation methods for non‑magnetic high‑frequency connectors
10.20 New project ballot initiated
Semiconductor device - The recognition criteria of defects in indium phosphide epitaxial wafers - Part 2: Test method for defects using optical microscopy
10.20 New project ballot initiated
Semiconductor device - The recognition criteria of defects in indium phosphide epitaxial wafers - Part 3: Test method for defects using scanning electron microscopy
10.20 New project ballot initiated
Integrated Circuits - Standard roadmap for chiplet ICs
00.00 Proposal for new project received
Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages
00.00 Proposal for new project received
IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages
00.99 Approval to ballot proposal for new project
Thermal standardization on semiconductor packages - Part 2-3: 3D thermal simulation models of semiconductor packages for steady-state analysis - LQFP packages
10.20 New project ballot initiated
IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device
10.60 Close of voting
Test method of sound variation detection sensors for fire detection
00.99 Approval to ballot proposal for new project
Semiconductor Devices - Part 16-XX: Microwave integrated circuits - Phase frequency detectors
10.60 Close of voting
Semiconductor devices - Part 20: Machine-Interpretable Data Sheet for Power Semiconductors: Requirements for Data Format and Data Access for Power Electronic Design Tools
10.60 Close of voting
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