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Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-55: Examinations and measurements –<br /> Attenuation and return loss of random mated single-mode weakly coupled 4-core rectangular ferrule multi-fibre connectors
10.20 New project ballot initiated
Fiber Optic Active Components and Devices – Test and Measurement Procedures – Part 8: Universal vertical mezzanine boards for photonic devices
10.60 Close of voting
Wind energy generation systems - Part 15-2: Framework for assessment and reporting of the wind resource and energy yield
10.60 Close of voting
Wind energy generation systems – Part 34: Fire prevention, protection and evacuation
10.20 New project ballot initiated
Grid Connection Requirements for Converter-Based Resources Interconnecting with Bulk Power Systems
10.20 New project ballot initiated
Grid-forming technology and applications in renewable energy dominated power systems
00.00 Proposal for new project received
Railway Applications – Requirements for software development
10.20 New project ballot initiated
Railway applications - Safety protocols for signaling applications - Part 1: Generic aspects of safety related transmission protocols
10.20 New project ballot initiated
Railway applicatios - Safety protocols for signaling applications - Part 3: PVS: Safety related transmission protocol for application between ground systems
10.20 New project ballot initiated
Railway applications - Safety protocols for signaling applications - Part 4: Rail Safe Transport Application Protocol
10.20 New project ballot initiated
Railway applications – Fixed installations – Lightning protection principles for overhead contact lines systems
10.20 New project ballot initiated
Materials for printed boards and other interconnecting structures - Part 2-XX: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate
10.60 Close of voting
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