IEC 60749-19:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Publication date: 29 nën 2010

General information

Current stage: 60.60 Effective date: 13 shk 2003

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

Buying

Statusi: Publikuar

PDF - 4 523 Lekë

Paper - 4 523 Lekë

CD - 4 523 Lekë

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Scope

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

PUBLISHED
IEC 60749-19:2003 ED1
60.60 Standard published
13 shk 2003

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60749-19:2003/AMD1:2010 ED1