SSH IEC 60749-19:2003

Pajisje gjysëmpërçuese - Metodat e provave mekanike dhe klimatike - Pjesa 19: Rezistenca ndaj prerjes së stampës

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Publication date: 5 dhj 2011

General information

Current stage: 60.60 Effective date: 5 dhj 2011

Originator: DPS

Owner: DPS/KT 7

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht

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Statusi: Publikuar

PDF - 2 439 Lekë

Paper - 2 439 Lekë

CD - 2 439 Lekë

PDF and Paper - 4 878 Lekë

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Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.

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PUBLISHED
SSH IEC 60749-19:2003
60.60 Standard published
5 dhj 2011

SSH IEC 60749-19:2003

Pajisje gjysëmpërçuese - Metodat e provave mekanike dhe klimatike - Pjesa 19: Rezistenca ndaj prerjes së stampës

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

General information

Buying

Scope

Life cycle

NOW

Related project

Adopted from IEC 60749-19:2003 ED1 IDENTICAL

Adopted from IEC 60749-19 Ed. 1.0 b