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SSH IEC 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Dec 5, 2011

General information

60.60     Dec 5, 2011

DPS

DPS/KT 7

International Standard

31.080.01  

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Scope

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.

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PUBLISHED
SSH IEC 60749-19:2003
60.60 Standard published
Dec 5, 2011

Related project

Adopted from IEC 60749-19:2003 ED1 IDENTICAL

Adopted from IEC 60749-19 Ed. 1.0 b