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IEC 60749-19:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Nov 29, 2010

General information

60.60     Feb 13, 2003

IEC

TC 47

International Standard

31.080.01  

English   French  

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Published

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Scope

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

PUBLISHED
IEC 60749-19:2003 ED1
60.60 Standard published
Feb 13, 2003

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60749-19:2003/AMD1:2010 ED1